Effect of H2O partial pressure and temperature during Ti sputtering on texture and electromigration in AlSiCu/Ti/TiN/Ti metallization.
| Autor: | Yoshida, Tomoyuki, Hashimoto, Shoji, Mitsushima, Yasuichi, Ohwaki, Takeshi, Taga, Yasunori |
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| Zdroj: | Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1998, Vol. 16 Issue 5, p2751-2758, 8p |
| Databáze: | Complementary Index |
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