Silicon nitride etching in high- and low-density plasmas using SF6/O2/N2 mixtures.
| Autor: | Reyes-Betanzo, C., Moshkalyov, S. A., Swart, J. W., Ramos, A. C. S. |
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| Zdroj: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 2003, Vol. 21 Issue 2, p461-469, 9p |
| Databáze: | Complementary Index |
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