Plasma enhanced chemical vapor deposition Si-rich silicon oxynitride films for advanced self-aligned contact oxide etching in sub-0.25 μm ultralarge scale integration technology and beyond.
| Autor: | Kim, Jeong-Ho, Yu, Jae-Seon, Ku, Ja-Chun, Ryu, Choon-Kun, Oh, Su-Jin, Kim, Si-Bum, Kim, Jin-Woong, Hwang, Jeong-Mo, Lee, Su-Youb, Kouichiro, Inazawa |
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| Zdroj: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 2000, Vol. 18 Issue 4, p1401-1410, 10p |
| Databáze: | Complementary Index |
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