Feature evolution during plasma etching. II. Polycrystalline silicon etching.
Autor: | Lane, J. M., Klemens, F. P., Bogart, K. H. A., Malyshev, M. V., Lee, J. T. C. |
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Zdroj: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 2000, Vol. 18 Issue 1, p188-196, 9p |
Databáze: | Complementary Index |
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