Plasma-enhanced chemical vapor deposition of thick silicon nitride films with low stress on InP.

Autor:	Shi, L., Steenbergen, C. A. M., de Vreede, A. H., Smit, M. K., Scholtes, T. L. M., Groen, F. H., Pedersen, J. W.
Zdroj:	Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1996, Vol. 14 Issue 2, p471-473, 3p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu