The effects of copper underlays on the stability of gold thin films during isothermal annealing.
| Autor: | Kim, J. Y., Hummel, R. E., DeHoff, R. T. |
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| Zdroj: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1989, Vol. 7 Issue 3, p1273-1278, 6p |
| Databáze: | Complementary Index |
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