Electronic structure and thermal stability of Ni/SiC(100) interfaces.
Autor: | Höchst, H., Niles, D. W., Zajac, G. W., Fleisch, T. H., Johnson, B. C., Meese, J. M. |
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Zdroj: | Journal of Vacuum Science & Technology: Part B-Microelectronics Processing & Phenomena; 1988, Vol. 6 Issue 4, p1320-1325, 6p |
Databáze: | Complementary Index |
Externí odkaz: |