Strain analysis in silicon substrates under uniaxial and biaxial stress by convergent beam electron diffraction.

Autor: Toh, Suey Li, Loh, K. P., Boothroyd, C. B., Li, K., Ang, C. H., Chan, L.
Zdroj: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 2005, Vol. 23 Issue 3, p940-946, 7p
Databáze: Complementary Index