Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects.
| Autor: | Wang, Grace, Jong, Yoo Won, Balakumar, S., Seah, C. H., Hara, T. |
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| Zdroj: | Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 2004, Vol. 22 Issue 5, p2384-2390, 7p |
| Databáze: | Complementary Index |
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