A comparative analysis of interconnection technologies for integrated multilayer inductors.

Autor: Reilly, Stephen O', Flannery, John, Donnell, Terence O', Muddiman, Andrew, Healy, Gerard, Byrne, Michael, Mathúna, Sean Cian Ó
Zdroj: Microelectronics International; 1998, Vol. 15 Issue 1, p6-10, 5p
Abstrakt: Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index