| Autor: |
Stephens, J., Greulich, F. |
| Zdroj: |
Metallurgical & Materials Transactions. Part A; 1995, Vol. 26 Issue 6, p1471-1482, 12p |
| Abstrakt: |
The Cu-Au-Ni braze alloys are used for metal/ceramic brazes in electronic assemblies because of their good wetting characteristics and low vapor pressure. We have studied the tensile creep properties of annealed 62Cu-35Au-3Ni alloy over the temperature range 250 °C to 750 °C. Two power-law equations have been developed for the minimum creep rate as a function of true stress and temperature. At the highest temperatures studied (650 °C and 750 °C), the minimum creep rate is well described with a stress exponent of 3.0, which can be rationalized in the context of Class I solid solution strengthening. The inverted shape of the creep curves observed at these temperatures is also consistent with Class I alloy behavior. At lower temperatures, power-law creep is well described with a stress exponent of 7.5, and normal three-stage creep curves are observed. Intergranular creep damage, along with minimum values of strain to fracture, is most apparent at 450 °C and 550 °C. The lower stress exponent in the Class I alloy regime helps to increase the strain to fracture at higher temperatures (650 °C and 750 °C). The minimum creep rate behavior of the 62Cu-35Au-3Ni alloy is also compared with those of the 74.2Cu-25. 8Au alloy and pure Cu. This comparison indicates that the 62Cu-35Au-3Ni has considerably higher creep strength than pure Cu. This fact suggests that the 62Cu-35Au-3Ni braze alloy can be used in low mismatch metal-to-ceramic braze joints such as Mo to metallized alumina ceramic with few problems. However, careful joint design may be essential for the use of this alloy in high thermal mismatch metal-to-ceramic braze joints. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
Full text from SpringerLink