Comparison of electromigration in submicron Al(Cu) and Cu thin film lines.
| Autor: | Hu, C.-K., Edelstein, D. C., Uzoh, C., Sullivan, T. |
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| Zdroj: | AIP Conference Proceedings; Jun1996, Vol. 373 Issue 1, p153-168, 16p |
| Databáze: | Complementary Index |
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