| Autor: |
Tan, Cher Ming, Linggajaya, Kaufik, Er, Eddie, Chai, Vincent Siew-Heong |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Components & Packaging Technologies; Dec99, Vol. 22 Issue 4, p551, 7p, 1 Black and White Photograph, 4 Diagrams, 5 Charts, 12 Graphs |
| Abstrakt: |
Investigates the dependence of wire bond-pull strength on the morphology of the underlying polycrystalline silicon beneath the bondpad metal using atomic force microscopy (AFM). Definitions of roughness parameters; Results of the roughness from AFM; Analysis of experimental results. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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