Moisture diffusion in poltimide films in integrated circuits.

Autor: Denton, D., Day, D., Priore, D., Senturia, S., Anolick, E., Scheider, D.
Zdroj: Journal of Electronic Materials; Mar1985, Vol. 14 Issue 2, p119-136, 18p
Abstrakt: This paper reports the use of planar aluminum-PI-aluminum capacitors, in which the variation of low frequency dielectric permittivity is shown to be proportional to absorbed moisture, to carry out in-situ studies of moisture uptake and diffusion in PMDA-ODA device-grade polyimide films. It is found that the equilibrium amount of moisture uptake depends on ambient relative humidity in the temperature range 20-80‡C, and that the diffusion kinetics obey a Fickian model with a diffusion coefficient in the range 3-5 x 10 cm /sec at room temperature. The diffusion coefficient is temperature dependent, with an activation energy of 0.32-0.34 eV, and is weakly dependent on absorbed moisture at fixed temperature. An asymmetry is observed between absorption and desorption kinetics which correlates with the moisture-dependent diffusion coefficient. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index