Analysis of Coulomb and Johnsen-Rahbek electrostatic chuck performance in the presence of particles for EUV lithography.

Autor: Sogard, Michael R., Mikkelson, Andrew R., Ramaswamy, Vasu, Engelstad, Roxann L.
Zdroj: Proceedings of SPIE; Nov2009 Part 2, Issue 1, p72710H-72710H-14, 14p
Databáze: Complementary Index