IMP copper seed layer formation with TaN barrier for deep submicron.
Autor: | Narayanan, Babu, Li, Chao Yong, Lee, Kangsoo, Yu, Bo, Wu, Jun J., Foo, Pang Dow, Xie, Joseph |
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Zdroj: | Proceedings of SPIE; Nov1999, Issue 1, p42-45, 4p |
Databáze: | Complementary Index |
Externí odkaz: |