IMP copper seed layer formation with TaN barrier for deep submicron.

Autor: Narayanan, Babu, Li, Chao Yong, Lee, Kangsoo, Yu, Bo, Wu, Jun J., Foo, Pang Dow, Xie, Joseph
Zdroj: Proceedings of SPIE; Nov1999, Issue 1, p42-45, 4p
Databáze: Complementary Index