Low-pressure aluminum planarization for sub-0.5-um contact and via holes.
| Autor: | Biberger, Maxmilian A., Conci, D., Lyons, J., Rumer, M, Tam, L., Tkach, G., Hoffman, V., Martin, E. P., Merchant, Sailesh M. |
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| Zdroj: | Proceedings of SPIE; Nov1997, Issue 1, p72-78, 7p |
| Databáze: | Complementary Index |
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