Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials.
| Autor: | Patel, Rajesh S., Bovatsek, James M. |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2007, Issue 1, p64590H-64590H-10, 10p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|