Innovative on-chip packaging applied to uncooled IRFPA.

Autor: Dumont, Geoffroy, Arnaud, Agnès, Imperinetti, Pierre, Mottin, Eric, Simoens, François, Vialle, Claire, Rabaud, Wilfried, Grand, Gilles, Baclet, Nathalie
Zdroj: Proceedings of SPIE; Nov2007 Part 2, Issue 1, p68350G-68350G-9, 9p
Databáze: Complementary Index