Integration and packaging of MEMS relays.
| Autor: | Kim, Jungsang, Bolle, Cristian A., Boie, R. A., Gates II, John V., Ramirez, A. G., Jin, Sungho, Bishop, David J. |
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| Zdroj: | Proceedings of SPIE; Nov2000 Part 2, Issue 1, p333-341, 9p |
| Databáze: | Complementary Index |
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