Finite element analysis of thermal stresses in laser packaging.
| Autor: | Sheen, Maw-Tyan, Chen, Cheng-Huang, Kuang, Jao-Hwa, Cheng, Wood-Hi, Chang, Hung-Lon, Wang, Szu-Chun, Wang, Chungyung, Wang, Chy-Ming, Liaw, Jy-Wang |
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| Zdroj: | Proceedings of SPIE; Nov1998, Issue 1, p93-101, 9p |
| Databáze: | Complementary Index |
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