Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process.

Autor: Bhave, Mandar, Edwards, Kevin, Washburn, Carlton A., Takei, Satoshi, Sakaida, Yasushi, Nakajima, Yasuyuki
Zdroj: Proceedings of SPIE; Nov2004, Issue 1, p640-647, 8p
Databáze: Complementary Index