Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process.
Autor: | Bhave, Mandar, Edwards, Kevin, Washburn, Carlton A., Takei, Satoshi, Sakaida, Yasushi, Nakajima, Yasuyuki |
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Zdroj: | Proceedings of SPIE; Nov2004, Issue 1, p640-647, 8p |
Databáze: | Complementary Index |
Externí odkaz: |