The impact of MEEF through pitch for 120-nm contact holes.
| Autor: | Litt, Lloyd C., Wu, Wei, Conley, Will, Lucas, Kevin D., Roman, Bernard J., Montgomery, Patrick, Kasprowicz, Bryan S., Progler, Christopher J., Socha, Robert J., Verhappen, Arjan, Wampler, Kurt E., Schaefer, Erika, Cook, Pat, Kuijten, Jan-Pieter, Pijnenburg, Wil |
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| Zdroj: | Proceedings of SPIE; Nov2004, Issue 1, p1305-1314, 10p |
| Databáze: | Complementary Index |
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