Simulating the effects of bake process parameters on resist thermal reflow.
| Autor: | Lee, Jae-Won, Feng, Zhaohua, Engelstad, Roxann L., Lovell, Edward G. |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2004, Issue 1, p1228-1239, 12p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|