Use of optical technique for inspection of warpage of IC packages.
| Autor: | Toh, Siew-Lok, Chau, Fook S., Ong, Sim Heng |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2001, Issue 1, p610-615, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Toh, Siew-Lok, Chau, Fook S., Ong, Sim Heng |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2001, Issue 1, p610-615, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|