Al-Si-Cu/TiN multilayer interconnection and Al-Ge reflow sputtering technologies for quarter-micron devices.
| Autor: | Kikkawa, Takamaro, Kikuta, Kuniko |
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| Zdroj: | Proceedings of SPIE; Nov1993, Issue 1, p54-64, 11p |
| Databáze: | Complementary Index |
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