High resolution imaging of electronic devices via x-ray diffraction topography.

Autor: Beard, W. T., Green, K. A., Zhang, X.-J., Armstrong, R. W.
Předmět:
Zdroj: Applied Physics Letters; 7/22/1996, Vol. 69 Issue 4, p488, 3p, 3 Black and White Photographs, 2 Diagrams, 1 Chart
Abstrakt: Measurements are reported for x-ray diffraction topography (XRDT) images of implantation and superstructure details in an integrated circuit device investigated with the reflection method of line modified-asymmetric crystal topography (LM-ACT). The x-ray penetration depth and the micron grain size of thin-film nuclear emulsions used to record the diffraction images are shown to limit spatial resolution in the x-ray topographs. © 1996 American Institute of Physics. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index