| Autor: |
Zhaozhi Li, Sangil Lee, Lewis, Brian J., Houston, Paul N., Baldwin, Daniel F., Stout, Eugene A., Tessier, Theodore G., Evans, John L. |
| Předmět: |
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| Zdroj: |
Journal of Microelectronic & Electronic Packaging; 2010 3rd Quarter, Vol. 7 Issue 3, p146-151, 6p, 12 Black and White Photographs, 4 Diagrams, 2 Charts, 3 Graphs |
| Abstrakt: |
The industry has witnessed the adoption of the flip chip for its low cost, small form factor, high performance, and great I/O flexibility. As three-dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon-to-silicon assembly, is gaining more and more popularity. No flow underfill is of special interest for the wafer level flip chip assembly, as it can dramatically reduce the process time and the cost per package, due to the reduction in the number of process steps as well as the dispenser and cure oven that would otherwise be necessary for the standard capillary underfill process. This paper introduces the development of a no flow underfill process for a sub-100 micron pitch flip chip to CSP wafer level assembly. Challenges addressed include the no flow underfill reflow profile study, underfill dispense amount study, chip floating control, underfill voiding reduction, and yield improvement. Also, different no flow underfill candidates were investigated to determine the best performing processing material. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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