| Autor: |
H Xu, C Liu, V V Silberschmidt, Z Chen, V L Acoff |
| Předmět: |
|
| Zdroj: |
Journal of Physics D: Applied Physics; Apr2011, Vol. 44 Issue 14, p145301-145301, 1p |
| Abstrakt: |
The effect of ultrasonic vibration on nanoscale interfacial structure of thermosonic copper wire bonding on aluminium pads was investigated. It was found that bonding strength was determined by the extent of fragmentation of a native aluminium oxide overlayer (5-10 nm thick) on aluminium pads, forming paths for formation of intermetallic compound CuAl2 in areas of direct contact of bonded metal surfaces. The degree of fracture of the oxide layer was strongly affected by a level of ultrasonic power. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
