| Autor: |
Veena, M. G., Renukappa, N. M., Shivakumar, K. N., Suresha, B. |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 10/4/2010, Vol. 1276 Issue 1, p219-226, 8p, 2 Diagrams, 3 Charts, 4 Graphs |
| Abstrakt: |
Nano-sized SiO2 particles were filled with epoxy matrix to prepare the nanocomposites. Nanocomposites were prepared by sol-gel technique. The effects of SiO2 content between 5-20 wt% were investigated, based on densification, microstructure, mechanical and electrical properties. The SiO2-Epoxy nanocomposites by the SiO2 content below 10 wt% exhibited excellent relative density over 3.8% with well dispersed SiO2. However, the SiO2-Epoxy nanocomposites containing SiO2 of 15 wt% and above possessed a relative density of 21.5%, accompanying SiO2 agglomerated and many pores located inside the agglomerates. The tensile strength gradually increased with the increase of SiO2 content up to 10 wt% and further increase of SiO2 decreased the tensile strength. However, the tensile modulus increased with increase in SiO2 content. SiO2 filler in epoxy influenced strongly the volume and surface resistivity. On the other hand, in samples containing more than 10 wt% of SiO2 in epoxy electrical volume resistivity showed a minimum. This decrease may be attributed to SiO2 particles have large amount of -OH impurities might have been adhered into the epoxy matrix. Further, the influence of sea water effect on volume resistivity of nanocomposites was discussed [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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