| Autor: |
Pynttari, Vesa J., Makinen, Riku M., Palukuru, Vamsi Krishna, Ostman, Kauko, Sillanpaa, Hannu P., Kanerva, Tomi, Lepisto, Toivo, Hagberg, Juha, Jantunen, Heli |
| Zdroj: |
IEEE Transactions on Electronics Packaging Manufacturing; Jul2010, Vol. 33 Issue 3, p221-227, 7p |
| Abstrakt: |
In this paper, characterization methods are presented with results from test structures printed with varying printing parameters and materials. It is shown that different process parameters affect both physical and electrical material properties and hence high-frequency material characterization is a vital part of the process providing important information for design purposes. The conductivities and loss information of nanoparticle inks and properties of dielectric material are achieved in addition to structural properties. In particular, dc measurement results from 1.1e7 S/m to 3.7e7 S/m and high-frequency attenuation values from 0.5 dB/cm to 2.8 dB/cm (at 10 GHz) are achieved for printed conductors. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
