| Autor: |
Ayliffe, M.H., Rolston, D.R., Chuah, A.E.L., Bernier, E., Michael, F.S.J., Kabal, D., Kirk, A.G., Plant, D.V. |
| Zdroj: |
Journal of Lightwave Technology; Oct2001, Vol. 19 Issue 10, p1543-1559, 17p |
| Abstrakt: |
Innovative approaches to the design and packaging of a high-performance module supporting a 32×32 array of GaAs multiple quantum-well (MQW) modulators flip-chip bonded to a 9×9 mm2 complementary metal-oxide-semiconductor (CMOS) chip are described. The module integrates a minilens array, a copper heat spreader, a thermoelectric cooler (TEC) and an aluminum heatsink. The minilens array is aligned and packaged with the chip using a novel six degrees of freedom (DOFs) alignment technique. The kinematic design allows for the manual insertion of the module into a free-space optical system with no need for further adjustments. The chip is mounted directly on a flexible printed circuit board (PCB) using a chip-on-board approach, providing over 200 bond pad connections to the chip. Impedance-controlled lines were operated at 1.0 Gb/s with a crosstalk of 4.0% between nearest neighbor lines. The junction-to-TEC thermal resistance is 0.4°C/W, allowing for the use of a single-stage TEC to regulate the chip at an operating temperature of 40°C under a maximum thermal load of 13.1 W [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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