| Autor: |
Chan, E.Y., Le, Q.N., Bernak, M.W., Yuing Huang, Koshinz, D.G., Hager, H.E. |
| Zdroj: |
IEEE Photonics Technology Letters; Nov2000, Vol. 12 Issue 11, p1549-1551, 3p |
| Abstrakt: |
We describe a high-performance, 12-channel multimode fiber-optic receiver array using a combined multichip module laminate (MCM-L), chip-on-board (COB), and ball grid array (BGA) packaging technology. The array operates at a minimum speed of 1.0625 Gb/s per channel with good channel-to-channel uniformity. Each channel has sensitivity better than ∼18 dSm and dynamic range better than 12 dB. Other important characteristics are good uniformity in rise time, fall time, and peak-to-peak output voltage amplitude across all the channels. The results demonstrate this OE receiver array packaging approach is applicable for a wide variety of platforms that have very stringent requirements in high packaging density, high performance, and low cost. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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