Air-gaps in 0.3 μm electrical interconnections.
| Autor: | Kohl, P.A., Bhusari, D.M., Wedlake, M., Case, C., Klemens, F.P., Miner, J., Byung-Chan Lee, Gutmann, R.J., Shick, R. |
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| Zdroj: | IEEE Electron Device Letters; Dec2000, Vol. 21 Issue 12, p557-559, 3p |
| Databáze: | Complementary Index |
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