Improvement mechanism of bondability in UF-bonded reed and wheat straw boards by silane coupling agent and extraction treatments.
| Autor: | Han, Guangping, Umemura, Kenji, Kawai, Shuichi, Kajita, Hiromu |
|---|---|
| Zdroj: | Journal of Wood Science; Aug1999, Vol. 45 Issue 4, p299-305, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
Full text from SpringerLink