Autor: |
Xu, Ju, Munari, Alessio, Dalton, Eric, Mathewson, Alan, Razeeb, Kafil M. |
Předmět: |
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Zdroj: |
Journal of Applied Physics; Dec2009, Vol. 106 Issue 12, p124310-124317, 7p, 2 Diagrams, 1 Chart, 6 Graphs |
Abstrakt: |
Silver nanowire arrays embedded inside polycarbonate templates are investigated as a viable thermal interface material for electronic cooling applications. The composite shows an average thermal diffusivity value of 1.89×10-5 m2 s-1, which resulted in an intrinsic thermal conductivity of 30.3 W m-1 K-1. The nanowires’ protrusion from the film surface enables it to conform to the surface roughness to make a better thermal contact. This resulted in a 61% reduction in thermal impedance when compared with blank polymer. An ∼30 nm Au film on the top of the composite was found to act as a heat spreader, reducing the thermal impedance further by 35%. A contact impedance model was employed to compare the contact impedance of aligned silver nanowire-polymer composites with that of aligned carbon nanotubes, which showed that the Young’s modulus of the composite is the defining factor in the overall thermal impedance of these composites. [ABSTRACT FROM AUTHOR] |
Databáze: |
Complementary Index |
Externí odkaz: |
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