| Autor: |
Lee, William, Power, Oliver, Fowler, Andrew, Healey, Sandra, Browne, John |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 9/9/2009, Vol. 1168 Issue 1, p1461-1464, 4p |
| Abstrakt: |
Polysilicon fuses are micron sized components of silicon chips. Unlike conventional fuses, they are blown as an irreversible programming step. They are used to isolate circuitry, to tune performance or to specialise the device. A fuse must be blown by applying a precise voltage which currently can only be determined by lengthly experimentation. A mathematical model of the blowing process could be used to eliminate the experimental step reducing the development time needed for new devices. We report progress towards a model describing the electronic, thermodynamic and fluid mechanical aspects of fuse blowing. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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