Wafer temperature measurements and end-point detection during plasma etching by thermal imaging.
| Autor: | Patel, V., Patel, M., Ayyagari, S., Kosonocky, W.F., Misra, D., Singh, B. |
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| Zdroj: | Applied Physics Letters; 9/9/1991, Vol. 59 Issue 11, p1299, 3p, 1 Diagram, 3 Graphs |
| Abstrakt: | Examines the use of thermal imaging for end-point detection during plasma etching of polycrystalline silicon layers. Uses of thermal imaging; Determination of the heat-transfer coefficient of the thermal contact between silicon wafer and water-cooled electrode. |
| Databáze: | Complementary Index |
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