| Autor: |
J.H.-G. Ng, M.P.Y. Desmulliez, M. Lamponi, B.G. Moffat, A. McCarthy, H. Suyal, A.C. Walker, K.A. Prior, D.P. Hand |
| Předmět: |
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| Zdroj: |
Circuit World; May2009, Vol. 35 Issue 2, p3-17, 15p |
| Abstrakt: |
The article offers information on a new manufacturing process that aims at micro-pattering of copper onto polyimide. It informs that many new techniques for metal deposition on non-conducting or smiconducting substrates has emerged through the investigation of cross-disciplinary routes ranging from organic chemistry, fluid dynamics, laser optics, and photochemistry. It reflects that direct writing process on polyimide is a much simplified metal-pattering process for flexible circuits and interconnections. It reflects is a transition from research phase to commercial scale process. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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