Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization.

Autor: Clément Barrière, Gilles Alcaraz, Olivier Margeat, Pierre Fau, Jean Baptiste Quoirin, Christine Anceau, Bruno Chaudret
Zdroj: Journal of Materials Chemistry; Jun2008, Vol. 18 Issue 26, p3084-3086, 3p
Abstrakt: We present a facile, room temperature and “fully liquid” method to specifically produce either copper nanoparticles or thin conductive copper films on silicon substrates by using a dedicated reduction process of mesitylcopper by H2 or an aminoborane. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index