On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys.

Autor:	Sidhu, Rajen S., Madge, Shantanu V., Xin Deng, Chawla, Nikhilesh
Předmět:	SILVER TIN INTERMETALLIC compounds METALS SOLDER & soldering ALLOYS
Zdroj:	Journal of Electronic Materials; Dec2007, Vol. 36 Issue 12, p1615-1620, 6p, 4 Black and White Photographs, 1 Chart, 3 Graphs
Abstrakt:	We report on the nature of the orientation of Ag3Sn and the Ag3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [ABSTRACT FROM AUTHOR]
Databáze:	Complementary Index
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