| Autor: |
Perfecto, Eric D., Longworth, Hai P., Sherif, Raed A., Ellsworth, Michael J., Yu, Roy |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; Feb98, Vol. 21 Issue 1, p20, 8p, 9 Black and White Photographs, 5 Charts, 3 Graphs |
| Abstrakt: |
Focuses on a state-of-the-art thin film technology used to manufacture MCM-D/C electronic packaging in the IBM mid-range power personal computer AS microprocessor. Information on the MCM-D/C; Discussion on the implementation of the MCM packaging; Background information relation to this topic. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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