| Autor: |
Adee, Sarah |
| Předmět: |
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| Zdroj: |
IEEE Spectrum; Jan2008, Vol. 45 Issue 1, p39-42, 4p |
| Abstrakt: |
The article provides information on the production issues of the ultimate dielectric made by Dan Edelstein together with Satya Nitta. It mentions that Edelstein and Nitta are now surrounding the conductors present in International Business Machines Corp. (IBM) bleeding-edge microprocessors with air gaps which serves as the vacuum cavities embedded in the insulation surrounding the wiring of the chips. It discusses that the air gaps might be the solution for the problems of the chip manufacturers believing that if someone crams nearly 10 kilometers of wiring into smaller spaces, the neighbors will feel the signal of the wire. Though it is a great idea, there are still questions on the production of the new technique and some says that it might be produced sometime this year. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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