| Autor: |
Ilpo Karjalainen, Teemu Sandelin, Jani Uusitalo, Reijo Tuokko |
| Předmět: |
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| Zdroj: |
Assembly Automation; 2004, Vol. 24 Issue 1, p58-62, 5p |
| Abstrakt: |
Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components on a PCB, the success of the automatic joining operation depends on many different things. Manufacturers of adhesives use three main values when they are discussing processing parameters in their data sheets. The paper describes in detail the concept of the developed assembly environment for making test joints of miniature and MEMS components using adhesive films. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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