Coefficient of thermal expansion and elastic modulus of thin films.

Autor: de Lima Jr., M. M., Lacerda, R. G.
Předmět:
Zdroj: Journal of Applied Physics; 11/1/1999, Vol. 86 Issue 9, p4936, 7p, 1 Diagram, 2 Charts, 7 Graphs
Abstrakt: Presents information on a study which investigated the coefficient of thermal expansion and biaxial modulus of some amorphous semiconductors and metallic thin films. Experimental procedure; Results and discussion; Conclusions.
Databáze: Complementary Index