Coefficient of thermal expansion and elastic modulus of thin films.
Autor: | de Lima Jr., M. M., Lacerda, R. G. |
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Předmět: | |
Zdroj: | Journal of Applied Physics; 11/1/1999, Vol. 86 Issue 9, p4936, 7p, 1 Diagram, 2 Charts, 7 Graphs |
Abstrakt: | Presents information on a study which investigated the coefficient of thermal expansion and biaxial modulus of some amorphous semiconductors and metallic thin films. Experimental procedure; Results and discussion; Conclusions. |
Databáze: | Complementary Index |
Externí odkaz: |