| Autor: |
Gu, M. X., Au Yeung, T. C., Tan, C. M., Nosik, V. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 11/1/2006, Vol. 100 Issue 9, p094304, 8p, 1 Diagram, 1 Chart, 3 Graphs |
| Abstrakt: |
The impact of bond order loss of surface atoms on thermal conductivity of cylindrical silicon nanowires has been examined using the isotropic elastic continuum model. A core-shell structure with a modified Young’s modulus in the surface skin of the wire has been used. Thermal conductivity is calculated from modified phonon dispersion relations based on recent developed bond-order-length-strength (BOLS) correlation. This work extends the previous linear approximation [Yeung et al. Phys. Rev. B 74, 155317 (2006)] to calculate the phonon dispersion relation of torsional mode and longitudinal mode using the nonlinear approach. A significant increase in thermal conductivity is found compared to the case without using BOLS correlation. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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