| Autor: |
Uchiyama, Hiroyuki, Ohta, Hiroshi, Shiota, Takashi, Takubo, Chisaki, Tanaka, Kenichi, Mochizuki, Kazuhiro |
| Předmět: |
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| Zdroj: |
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; Mar/Apr2006, Vol. 24 Issue 2, p664-668, 5p, 2 Black and White Photographs, 3 Diagrams, 3 Charts, 2 Graphs |
| Abstrakt: |
We investigated the properties of a citric acid-based GaAs/InGaP selective wet etchant. We found that the citric acid-based etchant has a much higher selectivity and exhibits less undercutting than those of a conventional sulfuric acid-based etchant that we had used. Then, we applied the citric acid-based wet etchant to the fabrication of via holes with high thermal diffusibility underneath heterojunction bipolar transistors. The citric acid-based etchant exhibited GaAs/InGaP selectivity of about 9800 at pH 9.0 and enabled reliable etch stopping without pinholes. The citric acid-based etchant also suppressed undercutting and enabled the integration of the via holes. We used the optimized citric acid-based wet etching for finishing the via hole etching after rough high-speed wet etching with the conventional sulfuric acid-based etchant. The two-step wet etching process resulted in a successful fabrication of the sub-transistor via hole structure with collector-up heterojunction bipolar transistors. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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