| Autor: |
Kai Xi, Rui Guo, Yangyang Weng, Hui He, Qiang Shao, Jie Cai, Qingmin Chen, Xuehai Yu, Xudong Jia |
| Předmět: |
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| Zdroj: |
Journal of Applied Polymer Science; Jan2007, Vol. 103 Issue 2, p1238-1243, 6p |
| Abstrakt: |
The distribution of pores and the mechanical properties of materials are the key factors in preparing satisfactory low‐k films. In the present study, a kind of silsesquioxane‐polyethylene glycol (SSQ‐PEG) was synthesized and used as a template to make the distribution of pores more even in the low‐k films. The crosslinking density of films could be adjusted by the sol‐gel of tetramethoxysilane/dimethoxydimethylsilane with various proportions. The porosity of films could also be adjusted with different proportions of pendant PEG chains introduced. A dielectric constant as low as 2.1 had been achieved for nanoporous polyorganosilicate films with good tenacity. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1238–1243, 2007 [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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Plný text