Mechanisms for microstructure evolution in electroplated copper thin films near room temperature.
| Autor: | Harper, J. M. E., Cabral Jr., C. |
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| Zdroj: | Journal of Applied Physics; 9/1/1999, Vol. 86 Issue 5, p2516, 10p, 1 Black and White Photograph, 3 Diagrams, 4 Graphs |
| Abstrakt: | Presents information on a study which focused on a model for microstructure evolution of electroplated copper thin films near room temperature. Experimental background; Effect of grain size on resistivity and mechanical properties; Discussion and conclusions. |
| Databáze: | Complementary Index |
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