| Autor: |
Fouassier, O., Heintz, J.-M., Chazelas, J., Geffroy, P.-M., Silvain, J.-F. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 8/15/2006, Vol. 100 Issue 4, p043519, 8p, 5 Black and White Photographs, 1 Diagram, 3 Charts, 3 Graphs |
| Abstrakt: |
Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from -50 to +150 °C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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